发明名称 |
RESIST DEVELOPMENT DEVICE, RESIST DEVELOPMENT METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a resist development device capable of supplying a developer to a semiconductor wafer much more than a conventional resist development device without increasing the quantity of the developer to be sprayed.SOLUTION: The resist development device is configured to spray the developer towards a carrier 100 in which a plurality of semiconductor wafers W can be accommodated, while revolving the carrier 100. The resist development device comprises: a rotational body that can be rotated around an axis A of rotation; a cradle that can be revolved in a predetermined direction D of rotation while holding the carrier 100; and a plurality of inner spray nozzles 32 that spray the developer from the inside of a trajectory to the outside of the trajectory. The inner spray nozzle 32 includes a spray hole 33 that defines a spray range at one side (upper side of revolving movement) within a spray range of the developer obliquely to the axis A of rotation downwards in a direction of gravity closer to one side and upwards in the direction of gravity closer to the other side.SELECTED DRAWING: Figure 3 |
申请公布号 |
JP2016163037(A) |
申请公布日期 |
2016.09.05 |
申请号 |
JP20150044087 |
申请日期 |
2015.03.05 |
申请人 |
SHINDENGEN ELECTRIC MFG CO LTD |
发明人 |
WATABE MASAYA |
分类号 |
H01L21/027;G03F7/38;H01L21/677 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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