Interconnect Structure for CIS Flip-Chip Bonding and Methods for Forming the Same

摘要

A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity.

主权项

1. A device comprising:
a metal pad at a surface of a semiconductor substrate, wherein the semiconductor substrate comprises an image sensor; a stud bump electrically connected to the metal pad, wherein the stud bump comprises a metal wire substantially perpendicular to the surface of the semiconductor substrate; and a first substrate bonded to the semiconductor substrate, wherein the first substrate comprises:
a first portion overlapping a portion of the semiconductor substrate, wherein the first portion of the first substrate comprises an electrical connector in contact with the metal wire of the stud bump; anda second portion connected to the first portion and extending along sidewalls of the semiconductor substrate.