发明名称 |
Camera module for compact electronic equipments |
摘要 |
In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.
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申请公布号 |
US7202460(B2) |
申请公布日期 |
2007.04.10 |
申请号 |
US20030634752 |
申请日期 |
2003.08.06 |
申请人 |
FUJITSU LIMITED |
发明人 |
ONODERA MASANORI;MORIYA SUSUMU;KOBAYASHI IZUMI;AOKI HIROSHI;HONDA TOSHIYUKI |
分类号 |
H01L27/00;H01L21/48;H01L21/56;H01L21/68;H01L23/00;H01L23/12;H01L23/31;H01L25/10;H01L25/18;H01L27/146;H01L27/148;H01L31/0203;H04N5/335 |
主分类号 |
H01L27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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