Systems and methods for fabrication of superconducting integrated circuits

摘要

Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.

主权项

1. An integrated circuit comprising:
a substrate; a Josephson junction carried by the substrate wherein the Josephson junction is comprised of a first electrode, a second electrode, and an electrically insulative layer interposed between the first and the second electrodes, and wherein the first and the second electrodes are each formed of a material that superconducts at or below a critical temperature; a first planarized dielectric layer carried by the Josephson junction; and a metal layer carried by the first planarized dielectric layer, wherein the metal layer includes at least one electrical current path that superconducts at or below a critical temperature; a superconducting via that superconductingly electrically couples at least one electrical current path from the metal layer with the first electrode of the Josephson junction, wherein the superconducting via comprises a hole extending through the dielectric layer that is at least partially filled with a material that is superconducting at or below a critical temperature; and a second planarized dielectric layer interposed between the Josephson junction and the substrate.