Chip extracting and transferring method for e.g. contactless smart card, involves directly and continuously transferring chips from adhesive film onto bond pads of antenna, and placing adhesive dielectric material between bond pads of chips

摘要

The method involves extracting good chips (20) from a silicon wafer (10) and transferring the chips onto an adhesive roll film (28) so that the chips are spaced apart by a certain pitch. The chips are directly and continuously transferred from the film onto bond pads of an antenna. The chips` transfer on the pads includes positioning the chips on an antenna support and exerting a pressure on the chips so that bond pads (22) of the chips deform the support. An adhesive dielectric material is placed between the pads (22) before positioning the chips to maintain the chips in a fixed position. An independent claim is also included for a device for extracting electronic chips from a silicon wafer.