| 摘要 |
PURPOSE:To reduce the capacity of a capacitor between inner electrodes remarkably, to reduce propagation delay time of a signal and to enable rapid treatment of the signal by forming a space between the inner electrodes which faces each other with a ceramic insulating layer therebetween. CONSTITUTION:Oxide copper paste is printed on a green sheet of glass, and a plurality of the printed green sheets are laminated by thermo-compression. After the binder is first fully removed for the laminated body in air of 350 deg.C, oxide copper is reduced to copper at 300 deg.C in a mixture gas of nitrogen and hydrogen. Copper is further sintered in nitrogen. Copper alone is shrunk in a temperature range of about 400 to 450 deg.C where a ceramic insulating layer in not sintered and a space is formed in advance between it and the ceramic insulating layer. Thereafter, the ceramic insulating layer and copper are fired simultaneously in nitrogen of 900 deg.C. Thereby, a ceramic multilayer interconnection substrate can be acquired which is provided with a space 3b between inner electrodes 1a and 1b facing each other with a ceramic insulating layer 2b therebetween. |
