发明名称 AN ARRANGEMENT FOR SHIELDING AND/OR COOLING ELECTRONIC COMPONENTS MOUNTED ON A CIRCUIT BOARD
摘要 An arrangement for shielding and/or cooling electronic components mounted on a circuit board includes a generally planar shielding hood and cooling elements. The shielding hood has downward extending side edges that extend around the perimeter and are intended to surround the component. Each cooling element has a generally planar underside and cooling fins disposed on the upper side. The arrangement also includes hook fasteners mounted on the surface of the circuit board and holders mounted on the cooling elements that coact with the hook fasteners. The hook fasteners press the cooling elements resiliently against the shielding hood and against the component. The holders can be brought into resilient, spring engagement with the hook fasteners. The shielding hood is adapted to the component, and when the component is to be shielded, the shielding hood is placed over the component. The cooling element is also adapted to the component, and when the component is to be cooled, the cooling element is placed either on the component or on the shielding hood over the component.
申请公布号 EP0755619(A1) 申请公布日期 1997.01.29
申请号 EP19950916074 申请日期 1995.04.04
申请人 TELEFONAKTIEBOLAGET LM ERICSSON 发明人 HENNINGSSON, BO, UNO, EGON;ARVIDSSON, STIG, ARTUR
分类号 H05K9/00;H01L23/40;H01L23/552;H01L23/58;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K9/00
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