发明名称 Molding die for covering optical fiber and optical fiber cover forming device
摘要 A mold is provided in which a molding portion, formed between joint surfaces of upper and lower molds superimposed one upon the other, is filled with UV curable resin after arranging a coating formation portion of an optical fiber in the molding portion, the coating formation portion is coated with the UV curable resin when the resin is cured by irradiating light thereto from outside, and a shading plate is arranged in the periphery of the molding portion. In a case equipped with the mold, there is provided a mirror or a lens for reflecting UV light to UV curable resin.
申请公布号 US7204683(B2) 申请公布日期 2007.04.17
申请号 US20040468674 申请日期 2004.03.15
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 SHIBATA TOSHIO;AKIYAMA TOMOHIRO;WATANABE HIDEKI;KOJIMA HIDEKAZU
分类号 B29C45/14;B29C70/74;C03C25/12;C03C25/18;G02B6/38 主分类号 B29C45/14
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