| 摘要 |
An SFP module mounting structure whereby the region of a printed wiring board for mounting SFP modules is enlarged and thus the SFP modules can be mounted with high density. A swing mechanism constituted by the coupling between a holder and a base allows the holder to be swung in directions toward and away from the printed wiring board. Thus, when mounting an SFP module, the SFP module can be inserted into the holder with the holder kept in an obliquely raised state relative to the printed wiring board. Also, when detaching the SFP module, the SFP module can be pulled out of the holder with the holder obliquely raised from the printed wiring board.
|
