| 摘要 |
PROBLEM TO BE SOLVED: To build in a smoothing circuit element within a card by forming a capacitor by film technique, and forming an inductance consisting of a magnetic film, an insulating film, and a conductive coil film by film technique. SOLUTION: A high dielectric film 2 is accumulated in a thickness of about 0.1-0.2μm on a conductive film 1, and it is heat-treated at about 800 deg.C. Then, Cu, etc., are accumulated in a thickness of about 1-5μm, and are patterned to form a conductive film 3. Then, CoZrTa, etc., are accumulated in a thickness of about 5-10μm, and is patterned to form a magnetic film 5. Furthermore, Cu, etc., are accumulated in a thickness of about 5-10μm and is patterned to form a conductive coil film 8. After application of flattening processing, a contact hole is made in the position where it is connected to the magnetic film 5. CoZrTa, etc., are accumulated in a thickness of about 5-10μm, and is patterned to form a magnetic film 9. Lastly, contact holes are made in the terminal positions A and B of the conductive coil film 8.
|
