| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturable by a simplified manufacturing process, and excellent in the temperature cycle resisting and hygroscopic reflow resisting properties, and its manufacturing process. SOLUTION: To obtain this device, an alkylene bistrimellitate polyimide film 1-3 having 3wt.% of remaining solvent or less, and a saturated coefficient of moisture absorption of 1vol.% or less at 85 deg.C and a RH of 85% is cut smaller than dimensions X, Y formed by the array of solder bumps 1-1 in the bonding pad parts of a semiconductor chip 1-2, and are heated and pressure-bonded to an organic printed wiring board. Then the semiconductor chip 1-2 is flip-chip- bonded with the surface down to a board terminal part 1-5 opposed to solder bumps 1-1, and simultaneously with it the surface of the semiconductor chip 1-2 is caused to adhere to the board, and the whole peripheral surfaces of solder joined parts and the whole surface or a part of the backside of the chip are sealed by sealing material 1-4. Consequently, it becomes possible to reduce the manufacturing cost, and to obtain a semiconductor device capable of enhancing the temperature cycle resisting and hygroscopic reflow resisting properties.
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