发明名称 GOLD ALLOY WIRE FOR BONDING
摘要 PROBLEM TO BE SOLVED: To provide a gold alloy wire which has improved reliability of junction performance, when it is held in a high temperature environment for a long time, and further has superior performances in sphericity of alloy balls, vibration breakage rate and IC chip crackings. SOLUTION: One to less than 1,000 wt.ppm of at least one of Co and Zn, one to less than 1,000 wt.ppm and one to less than 400 wt.ppm of at least one of La, Y, Ga, Be, Ca and Eu are contained in high purity gold. Or, one to less than 1,000 wt.ppm of Co is contained in high purity gold.
申请公布号 JP2000357706(A) 申请公布日期 2000.12.26
申请号 JP19990130377 申请日期 1999.05.11
申请人 TANAKA ELECTRONICS IND CO LTD 发明人 TAKAURA SHIN
分类号 H01L21/60 主分类号 H01L21/60
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