| 摘要 |
PROBLEM TO BE SOLVED: To avoid malfunction resulting from undesired voltage drop after a semiconductor chip is manufactured. SOLUTION: In the semiconductor integrated circuit, a plurality of blocks which are divided and formed in a prescribed circuit scale, first power supply wirings (101, 102, 103, 104) for supplying power to a plurality of the blocks, a second power supply wiring (109) for taking in voltage of a level higher than the power supply voltage taken in through the first power supply wiring, and a power supply path switch means (105, 106, 107, 108) which can be changed into power supply from a second power supply wiring are installed. After semiconductor chip manufacture, power supply from the first power supply wirings can be changed into power supply from the second power source wiring, thereby avoiding the malfunction resulting from undesired voltage drop. As a result, power supply is performed to a part where undesired voltage drop is generated or a part where the degree of seriousness is high, through the second power supply wiring prepared independently of the first power supply wirings, so that various troubles resulting from the undesired voltage drop can be avoided. COPYRIGHT: (C)2005,JPO&NCIPI
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