| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a WCSP (Wafer Level Chip Size Package) with which a projecting electrode can be accurately sealed. <P>SOLUTION: A method for manufacturing a semiconductor device includes steps for setting a semiconductor chip forming area including a plurality of semiconductor chip areas 20a divided by scribe lines L1, and a peripheral area surrounding the semiconductor chip forming area on the principal surface of a semiconductor wafer; forming a circuit element and a plurality of circuit element connecting pads 18 connected to the circuit element in each of the plurality of semiconductor chip areas; forming an insulating film partially exposing each of the plurality of circuit element connecting pads on the principal surface; forming a plurality of projecting electrodes 28 disposed at predetermined intervals in the semiconductor chip forming area on the insulating film on each semiconductor chip area; forming a sealing portion exposing top faces of the projecting electrodes on the insulating film; and cutting the semiconductor wafer along with the scribe lines. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
