发明名称 ELECTRONIC CIRCUIT MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic circuit module mounted with a plurality of electronic circuit units which can be reduced in area without deteriorating the performance of each electronic circuit unit and without increasing the number of module substrate layers. <P>SOLUTION: In the electronic circuit module, the plurality of electronic circuit units are mounted on a single module substrate 1. The first electronic circuit unit 11 has a large generation of heat. The second electronic circuit unit 21 and the third electronic circuit unit 31 has heat generation not as large as the first one. The first electronic circuit unit is mounted in such manner that the face with no formation of active elements may be in contact with the module substrate, and the third electronic circuit unit is so mounted as to be laid upon the second electronic circuit unit. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005235825(A) 申请公布日期 2005.09.02
申请号 JP20040039523 申请日期 2004.02.17
申请人 RENESAS TECHNOLOGY CORP 发明人 OKABE HIROSHI
分类号 H01L25/18;H01L21/60;H01L23/66;H01L25/04;H01L25/065;H01L25/16;H04B1/38;H05K1/02;H05K1/14;H05K7/06;H05K7/20 主分类号 H01L25/18
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