发明名称 Methods of filling gaps by deposition on materials having different deposition rates
摘要 Methods of forming material in a gap in a substrate include forming a pattern to define a gap on a substrate. A bottom oxide layer is formed on a surface of the substrate and substantially filling the gap. The bottom oxide layer is etched back inside an opening in the gap to expose side walls of the gap so that a residual bottom oxide layer remains at a bottom of the gap. A top oxide layer is selectively deposited on the residual bottom oxide layer, wherein the top oxide layer is deposited in a first direction toward the opening at a faster rate than in a second direction away from the side walls.
申请公布号 US7358190(B2) 申请公布日期 2008.04.15
申请号 US20030732931 申请日期 2003.12.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM HONG-GUN;NA KYU-TAE;HONG EUN-KEE;GOO JU-SEON
分类号 H01L21/31;H01L21/311;H01L21/316;H01L21/762 主分类号 H01L21/31
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