发明名称 Wired circuit board
摘要 A wired circuit board has a plurality of insulating layers, a conductive layer having a signal wiring extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer having a ground wiring covered with the insulating layers and formed to surround the signal wiring in a perpendicular direction to the longitudinal direction, and a ground connecting terminal provided on a longitudinal end of the ground wiring and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.
申请公布号 US2008087455(A1) 申请公布日期 2008.04.17
申请号 US20070902556 申请日期 2007.09.24
申请人 NITTO DENKO CORPORATION 发明人 HU SZU-HAN;HO VOON Y.;YAMAZAKI HIROSHI;MCCASLIN MARTIN J.
分类号 H01B7/00 主分类号 H01B7/00
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