| 摘要 |
<p>Disclosed is a synthetic grindstone used for polishing of a silicon wafer, which is composed of a structure comprising cerium oxide fine particles as abrasive grains, a resin as a binder, a salt as a filler and a nanodiamond as an additive. This synthetic grindstone is characterized in that the purity of the cerium oxide is not less than 60% by weight, the content of the salt as a filler is not less than 1% but not more than 20%, the volume content of the nanodiamond as an additive is not less than 0.1% but less than 20% relative to the total volume of the structure, and the porosity as the volume fraction relative to the total volume of thestructure is less than 30%.</p> |
