发明名称 COOLING STRUCTURE AND HEAT GENERATING BODY
摘要 A first heat generating body (11), a cooling body 3, which is joined to one surface of the first heat generating body, second heat generating bodies (22, 23), and heat transfer plates (32, 33), which transfer the heat of the second heat generating bodies to the cooling body, are provided, wherein the first heat generating body is surface-to-surface joined to the cooling body by a first junction surface (3d), and the heat transfer plates are surface-to-surface joined to the cooling body by a second junction surface (3c) which does not overlap the first junction surface.
申请公布号 EP2911193(A4) 申请公布日期 2016.06.15
申请号 EP20130847105 申请日期 2013.06.20
申请人 FUJI ELECTRIC CO., LTD. 发明人 TANAKA, YASUHITO;ABE, SHINICHI
分类号 H05K7/20;H01L23/40;H01L23/473;H01L25/07 主分类号 H05K7/20
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