发明名称 |
Semiconductor device |
摘要 |
A semiconductor device according to an embodiment includes a SiC layer including a first region provided at a surface. The first region satisfies NA−ND<5×1015 cm−3 when a concentration of a p-type impurity is denoted by NA, whereas a concentration of an n-type impurity is denoted by ND. The surface is inclined at 0 degrees or more and 10 degrees or less to a {000-1} face, or the surface having a normal direction inclined at 80 degrees or more and 90 degrees or less to a <000-1> direction. The device includes a gate electrode, a gate insulating film provided between the SiC layer and the gate electrode, and a second region provided between the first region and the gate insulating film. The second region has a nitrogen concentration higher than 1×1022 cm−3. |
申请公布号 |
US9443937(B2) |
申请公布日期 |
2016.09.13 |
申请号 |
US201514807369 |
申请日期 |
2015.07.23 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Iijima Ryosuke;Ohashi Teruyuki;Shimizu Tatsuo;Shinohe Takashi |
分类号 |
H01L29/15;H01L29/16;H01L29/51;H01L29/739;H01L29/78;H01L29/04;H01L29/08;H01L29/10;H01L29/94 |
主分类号 |
H01L29/15 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P |
主权项 |
1. A semiconductor device comprising:
a SiC layer including a first region provided at a surface, the first region satisfies NA−ND<5×1015 cm−3 when a concentration of a p-type impurity is denoted by NA, whereas a concentration of an n-type impurity is denoted by ND, the surface being inclined at 0 degrees or more and 10 degrees or less to a {000-1} face, or the surface having a normal direction inclined at 80 degrees or more and 90 degrees or less to a <000-1> direction; a gate electrode; a gate insulating film provided between the SiC layer and the gate electrode; and a second region provided between the first region and the gate insulating film, the second region having a nitrogen concentration higher than 1×1022 cm−3. |
地址 |
Minato-ku JP |