发明名称 半導体装置
摘要 The degree of integration of a semiconductor device is enhanced and the storage capacity per unit area is increased. The semiconductor device includes a first transistor provided in a semiconductor substrate and a second transistor provided over the first transistor. In addition, an upper portion of a semiconductor layer of the second transistor is in contact with a wiring, and a lower portion thereof is in contact with a gate electrode of the first transistor. With such a structure, the wiring and the gate electrode of the first transistor can serve as a source electrode and a drain electrode of the second transistor, respectively. Accordingly, the area occupied by the semiconductor device can be reduced.
申请公布号 JP6005356(B2) 申请公布日期 2016.10.12
申请号 JP20110282898 申请日期 2011.12.26
申请人 株式会社半導体エネルギー研究所 发明人 山崎 舜平
分类号 H01L21/8242;H01L21/28;H01L21/336;H01L21/8234;H01L21/8244;H01L21/8247;H01L27/088;H01L27/10;H01L27/108;H01L27/11;H01L27/115;H01L29/417;H01L29/423;H01L29/49;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/8242
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