Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

摘要

The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a plurality of leads arranged between the suspension leads; a semiconductor chip mounted on the chip supporting surface of the tab, the semiconductor chip including a main surface, a plurality of pads formed on the main surface, and a rear surface opposite to the main surface; a seal portion sealing the semiconductor chip such that a part of each of the leads is exposed from the seal portion; and a Pb-free solder formed on the part of each of the leads. A part of the rear surface of the semiconductor chip is contacted with the seal portion.

主权项

1. A semiconductor device, comprising:
a die pad; a semiconductor chip disposed on the die pad, the semiconductor chip including a main surface on which a plurality of pads are formed; a plurality of suspension leads connected with the die pad; a plurality of leads arranged around the die pad in plan view and also arranged between the plurality of suspension leads in plan view; a plurality of wires electrically connecting the plurality of pads of the semiconductor chip with the plurality of leads, respectively; and a seal portion sealing the semiconductor chip and the plurality of wires, wherein in the seal portion, the plurality of suspension leads are extended toward corner portions of the seal portion from a central portion of the seal portion, respectively, wherein in the seal portion, the plurality of leads are only extended in first directions perpendicular to sides of the seal portion, respectively, wherein the seal portion includes a front surface located at a same side as the main surface of the semiconductor chip, and a rear surface opposite to the front surface, wherein each of the plurality of leads includes a wire connection surface located at the same side as the main surface of the semiconductor chip, and a back surface opposite to the wire connection surface and also exposed from the rear surface of the seal portion, wherein the plurality of leads includes a first lead adjacent to a first suspension lead of the plurality of suspension leads, and a second lead adjacent to the first lead and also arranged farther than the first lead from the first suspension lead, wherein the back surface of the first lead includes a first side located beside the first suspension lead, and a second side opposite to the first side, wherein the back surface of the first lead further includes a first corner portion closest to the first suspension lead, and wherein the first corner portion is chamfered such that a length of the first side is shorter than a length of the second side.