发明名称 |
Semiconductor Packages Having Package-On-Package Structures |
摘要 |
A semiconductor package includes a lower package with a lower semiconductor chip on a lower package substrate, and an upper package with an upper semiconductor chip on an upper package substrate. The upper semiconductor chip has a plurality of chip pads and the upper package substrate has a plurality of substrate pads. The upper package is stacked on the lower package. The chip pads have a first pitch and the substrate pads have a second pitch greater than the first pitch. The upper package substrate has a plurality of connection lines that electrically connect the substrate pads to the chip pads. |
申请公布号 |
US2016322338(A1) |
申请公布日期 |
2016.11.03 |
申请号 |
US201615160143 |
申请日期 |
2016.05.20 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
HWANG Taejoo |
分类号 |
H01L25/10;H01L25/18;H01L25/00 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Suwon-si KR |