发明名称 |
METHOD OF TRANSFERRING AND ELECTRICALLY JOINING A HIGH DENSITY MULTILEVEL THIN FILM TO A CIRCUITIZED AND FLEXIBLE ORGANIC SUBSTRATE AND ASSOCIATED DEVICES |
摘要 |
A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer. |
申请公布号 |
US2016322284(A1) |
申请公布日期 |
2016.11.03 |
申请号 |
US201615205416 |
申请日期 |
2016.07.08 |
申请人 |
HARRIS CORPORATION |
发明人 |
WEATHERSPOON MICHAEL RAYMOND;NICOL DAVID B.;RENDEK, JR. LOUIS JOSEPH |
分类号 |
H01L23/498;H01L25/065;H01L23/00;H01L25/00;H01L21/48;H01L21/683 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
MELBOURNE FL US |