POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

A power module or the like is provided in which lower inductance and miniaturization are achieved. The power module includes: main body units (11 to 13), cooling units (21 to 24) which cool the main body units (11 to 13), busbars (51, 52) connected to power terminals (1i, 1j) of the main body units (11 to 13), a casing (W) in which at least contact parts with the busbars (51, 52) are insulative, and a metal member (30) which supports the casing (W). The metal member (30) tightly contacts the casing (W), thereby forming a box with one side opened. At least the main body units (11 to 13) and the busbars (51, 52) are arranged inside the box. An insulating sealant is provided to fill the inside of the box.

主权项

1. A power module comprising:
a main body unit having a semiconductor element, a control terminal connected to the semiconductor element, a power terminal through which a current corresponding to an electrical signal to the control terminal flows, and a heat dissipation layer; a cooling unit which is arranged in such a way as to be able to exchange heat with the heat dissipation layer and cools the main body unit; a busbar connected to the power terminal; a casing in which at least a contact part with the busbar is insulative; and a metal member which supports the casing; wherein the metal member tightly contacts the casing, thereby forming a box with one side opened, at least the main body unit and the busbar are arranged inside the box, the control terminal and the power terminal extend to the one side from the semiconductor element, and an insulating sealant is provided to fill the inside of the box, thereby sealing the main body unit and the busbar.