| 摘要 |
PURPOSE:To reduce the substrate wiring density of an LED head to a half, and enable the use of a hard printed board. CONSTITUTION:LED arrays L1-L40 are arranged in a row on the first main surface of a substrate 2, and the first substrate wiring 4 and the second substrate wiring 6 are installed on both sides of the row of LED arrays L1-L40. The substrate wirings 4, 6, which cut every two LED arrays, are connected to each other at rows 20, 22 of a through hole 14 and are connected with a common electrode of the LED arrays L1-L40 from the clearances of the substrate wiring 6. |
