发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR SILICON EPITAXIAL WAFER AND SEMICONDUCTOR DEVICE |
摘要 |
<p>A method for manufacturing semiconductor silicon epitaxial wafer and semiconductor device by which a gettering ability can be given to an epitaxial wafer in which the formation of BMD is not able to be expected in both low- and high-temperature device manufacturing processes, with the manufacturing processes being lower and higher than 1,050 DEG C in temperature, and has a specific resistance of >/= 10m OMEGA .cm. When this method is used, such BMD that is sufficient to obtain gettering can be formed in both the low- and high-temperature processes, with the manufacturing processes being lower and higher than 1,050 DEG C in temperature, even in the epitaxial wafer having a specific resistance of >/= 10 m OMEGA .cm by performing low-temperature heat treatment at 650 SIMILAR 900 DEG C before starting epitaxial film formation, by selecting the heat-treating time in accordance with the process temperature in the device manufacturing processes and heavy-metal contaminants which are mixed in during the device manufacturing processes can be gettered sufficiently. Therefore, the characteristic deterioration of a device can be prevented and the yield of the device can be improved. <IMAGE></p> |
申请公布号 |
EP0954018(A1) |
申请公布日期 |
1999.11.03 |
申请号 |
EP19970913486 |
申请日期 |
1997.12.02 |
申请人 |
SUMITOMO METAL INDUSTRIES LIMITED |
发明人 |
SADAMITSU, SHINSUKE;NAGASHIMA, TOORU;KOIKE, YASUO;NINOMIYA, MASAHARU;KII, TAKESHI |
分类号 |
C30B29/06;H01L21/322;C30B33/02;(IPC1-7):H01L21/322 |
主分类号 |
C30B29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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