发明名称 HIGH-SPEED CIRCUIT-MOUNT STRUCTURE
摘要 PROBLEM TO BE SOLVED: To achieve low EMI structure where a noise current and unneeded radiation which is generated at the connections between a relay connector and a multilayer substrate are reduced, the structure can be miniaturized, the density is increased, and the cost are reduced. SOLUTION: Structure is provided with coaxial cables 10(10a and 10b) where a signal line and its surrounding ground are arranged coaxially, signal through hole 30(30a and 30b) that are installed, while being connected to signal wiring 34 and 37 being formed at signal layers 14(14a and 14b), and multilayer substrates 16(16a, 16b-16e) with paired ground layers 15(15a-15c) for sandwiching the signal layers 14 and ground through holes 17(17a-17c) that are connected to ground wiring 32, and a relay connector 100 for connecting the transfer mode of a strip line with signal leads 26(26a and 26b) and 12 12a and 12b) for connecting the coaxial cables 10 (10a and 10b) to the multilayer substrates 16(16a, 16b-16e) and ground plates 25(25a and 25b) and 13(13a and 13b), for holding the signal leads 26 and 12. The structure reduces the noise current and unwanted radiation.
申请公布号 JP2000183582(A) 申请公布日期 2000.06.30
申请号 JP19980354866 申请日期 1998.12.14
申请人 HITACHI LTD 发明人 AOYAGI PAUL;SUGA TAKU;KASUKABE SUSUMU;ISADA NAOYA;HAYASHI YOSHIHIKO
分类号 H05K1/02;H05K3/34;H05K3/42;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K1/02
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