发明名称 Mold clamping control apparatus
摘要 PCT No. PCT/JP99/01584 Sec. 371 Date Nov. 16, 1999 Sec. 102(e) Date Nov. 16, 1999 PCT Filed Aug. 29, 1999 PCT Pub. No. WO99/50045 PCT Pub. Date Oct. 7, 1999A mold clamping control apparatus (49) capable of accurately generating mold clamping force is provided. The mold clamping control apparatus (49) comprises: a stationary platen (11) to which a stationary mold (15) is attached; a movable platen (34) to which a movable mold (16) is attached, the movable platen (34) being disposed to reciprocate while facing the stationary platen (11); a driver; a movement member which is moved through drive of the driver; a transmission mechanism connecting the movement member and the movable platen (34); detector for detecting the position of the movement member; memory for storing, in a relational manner, positions of the movement member during movement in accordance with a predetermined position pattern, and a mold clamping force generated at each of the positions; a mold clamping force setting device (50) for setting a mold clamping force; a mold clamping force pattern generator (51) for generating a mold clamping force pattern on the basis of the set mold clamping force; and position controller reading from the memory positions of the movement member corresponding to the mold clamping force pattern and for driving the driver on the basis of the read positions. In a mold clamping force adjustment mode, positions of the movement member during movement in accordance with a predetermined position pattern and a mold clamping force generated at each of the positions are stored in the memory in a relational manner. In a mold clamping force generation mode, positions of the movement member corresponding to the mold clamping force pattern are read from the memory.
申请公布号 US6157158(A) 申请公布日期 2000.12.05
申请号 US19990423631 申请日期 1999.11.16
申请人 SUMITOMO HEAVY INDUSTRIES, LTD. 发明人 ISHIKAWA, ATSUSHI
分类号 B29C45/64;B29C45/66;B29C45/76;B29C45/77;(IPC1-7):G05G5/00 主分类号 B29C45/64
代理机构 代理人
主权项
地址