| 摘要 |
A testing and finishing system for a discrete or combinational use of apparatus in an automated method of testing, marking, sorting and packing integrated circuit package units is disclosed. The assembly facility comprises: an automated loading machine feeding package units; an environmental test station preceded by an environmental chamber that conditions the units; a transportation means elevating the position of each unit to be processed; an ambient temperature test station; a unit flipper device; a degreasing means; a marking means; a curing means; a lead scanning and straightening mechanism; and an automated binning, buttoning and packing machine.
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