发明名称 Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same
摘要 An integrated circuit includes a substrate having a surface. A first conductive path is disposed on the substrate at a first level and has a first height. A second conductive path is also disposed on the substrate at the first level and has a second height that is significantly different than the first height. Where the integrated circuit is a memory circuit, the digit lines formed from a layer can have a smaller height than other signal lines that are formed from the same layer. Thus, the capacitive coupling between the digit lines can be reduced without degrading the current carrying capability of the other signal lines.
申请公布号 US6396727(B1) 申请公布日期 2002.05.28
申请号 US20000505943 申请日期 2000.02.15
申请人 MICRON TECHNOLOGY, INC. 发明人 SCHOENFELD AARON;SOMASEKHARAN RAJESH
分类号 H01L21/768;H01L21/8242;H01L23/528;(IPC1-7):G11C5/02 主分类号 H01L21/768
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