| 摘要 |
An observable sample mounting fixture for mounting an IC specimen to a protective substrate is provided. In the sample mounting fixture, a base portion and a top portion are provided which are integrally connected together with a cavity therein-between for receiving a specimen. The base portion is further provided with an observation window such that the state of cure of an adhesive layer between a substantially transparent substrate and the IC specimen can be observed in real time. During an early observation, i.e., when the sandwiched structure is only cured for 2-5 minutes, the sandwiched structure can be easily disassembled when bubbles are observed. By utilizing the present invention novel sample mounting fixture, valuable test specimens can be saved for providing valuable quality control and reliability data. The sample mounting fixture is further constructed with a compression means which includes a shaft, a coil spring, a handle and a compression foot for contacting the IC specimen during a curing process of the sandwiched structure.
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