| 摘要 |
A printed circuit board, containing thermal pads, is adhered to a rigidizer plate whereupon the entire unit can then be bent over itself to create a compact assembly which can be substantially smaller, but contain the same number of traces and electrical components, as an unbent printed circuit board of the same surface area. Further, a complete housing assembly is formed which is sealed on each edge of the rigidizer by inserting the edge into a panel with a groove. This assembly provides a secure fit that provides great stability with a relatively low weight and volume. The assembly also provides a better RF non-mechanical connection and much better thermal performance.
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