| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding apparatus wherein a guide tube is simply attached/detached while keeping the apparatus compact, a heating effect to the guide tube is sufficiently developed, and an ultrasonic wave from a vibration propagation support to the guide tube is propagated with an excellent propagation efficiency. <P>SOLUTION: The wire bonding apparatus 10 includes the guide tube 32 for guiding a metallic wire 31 to a bonded part; an ultrasonic wave resonator 33 for oscillating ultrasonic vibration; the vibration propagation support 34 to which the guide tube 32 is freely removably loaded, and propagates the ultrasonic vibration oscillated by the ultrasonic resonator 33 to the guide tube 32; and a heating means 35 for heating the guide tube 32 and the metallic wire 31. The heating means 35 is located in a recess 46 formed to the position of the vibration propagation support 34 to which the tube guide 32 is loaded. <P>COPYRIGHT: (C)2007,JPO&INPIT |
