| 摘要 |
A heat sink, applied to at least two heating elements including first and second integrated circuit packages (4, 6) mounted on a printed wiring board (2), includes: a base member (8) having a lower surface and an upper surface, said lower surface being fixed to said first and second integrated circuit packages, said upper surface having a blowing region (10) defined between said first and second integrated circuit packages and a plurality of upward projecting radiation fins (12) formed at a portion except said blowing region, and air cooling means provided in said blowing region for circulating air through said radiation fins. <IMAGE> |
