| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means for preventing rupture of a resistor film by eliminating a local thermal expansion of a dielectric film caused by heat from a resistor, in a circuit board having the resistor film on the dielectric film. <P>SOLUTION: In the circuit board 1, a resistor film 6 and a wiring conductor film 7 are arranged, while being contacted directly on a dielectric BCB film 3 of a microstrip line. A recess 10 is formed, in which the thickness of the BCB film 3 immediately below the resistor film 6 is made smaller in comparison with those of other thicknesses, and the resistor film 6 is formed on the BCB film 3 in the recess 10. Heat of the resistor film 6 is quickly dissipated to a ground conductor film 2 via the thinned portion. <P>COPYRIGHT: (C)2007,JPO&INPIT |
