| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate on which an electronic component such as a semiconductor element is mounted via a conductive member and a structure for mounting the electronic component on the wiring substrate which realize a highly reliable mounting structure in which the connection stability (yield) of a convex outer connection terminal of the electronic component and a conductive layer of the wiring substrate is improved. <P>SOLUTION: In a wiring substrate 11 on one principal surface of which a plurality of electrode terminals 16 to which an outer connection terminal 14 of an electronic component 12 is connected are arranged in line, the electrode terminal 16 has a first straight line-shaped portion 16-1, a second straight line-shaped portion 16-2 extending in a direction different from that of the first straight line-shaped portion 16-1 at the end of the first straight line-shaped portion 16-1, and a bending portion 16-3 in a portion in which the first straight line-shaped portion 16-1 and the second straight line-shaped portion 16-2 are continuous with each other. <P>COPYRIGHT: (C)2008,JPO&INPIT |
