发明名称 Semiconductor Integrated Circuit Devices Having Conductive Patterns that are Electrically Connected to Junction Regions and Methods of Fabricating Such Devices
摘要 A semiconductor integrated circuit device includes a semiconductor substrate; a dummy pattern extending in one direction on the semiconductor substrate; a junction region electrically connecting the dummy pattern to the semiconductor substrate; and a voltage applying unit that is configured to apply a bias voltage to the dummy pattern.
申请公布号 US2009008740(A1) 申请公布日期 2009.01.08
申请号 US20080165827 申请日期 2008.07.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE BONG-HYUN;CHOI JUNG-YUN
分类号 H01L27/105 主分类号 H01L27/105
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