发明名称 |
Semiconductor Integrated Circuit Devices Having Conductive Patterns that are Electrically Connected to Junction Regions and Methods of Fabricating Such Devices |
摘要 |
A semiconductor integrated circuit device includes a semiconductor substrate; a dummy pattern extending in one direction on the semiconductor substrate; a junction region electrically connecting the dummy pattern to the semiconductor substrate; and a voltage applying unit that is configured to apply a bias voltage to the dummy pattern.
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申请公布号 |
US2009008740(A1) |
申请公布日期 |
2009.01.08 |
申请号 |
US20080165827 |
申请日期 |
2008.07.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE BONG-HYUN;CHOI JUNG-YUN |
分类号 |
H01L27/105 |
主分类号 |
H01L27/105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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