| 摘要 |
A printed circuit board according to an embodiment of the present invention comprises: a first conductive layer which includes a recess portion, a bump portion having a level higher than the recess portion, and a coupling portion which couples the recess portion with the bump portion; a second conductive layer which is formed on the recess portion of the first conductive layer such that the bump portion is exposed; a core layer which is interposed between the first conductive layer and the second conductive layer; an upper solder resist layer which covers the second conductive layer such that at least a portion of the bump portion is exposed; and a lower solder resist layer which is arranged below the first conductive layer. According to an embodiment of the present invention, it is possible to manufacture a printed circuit board which does not include vias. |
