发明名称 |
Method for fabricating electronic devices having semiconductor memory unit |
摘要 |
Devices and methods based on disclosed technology include, among others, an electronic device including silicide layers capable of effectively reducing contact resistance in the electronic device including buried gates and a method for fabricating the electronic device. Specifically, an electronic device in one implementation includes a plurality of buried gates formed in a substrate and silicide layers formed over the substrate between the buried gates and protruding upwardly from the buried gates. |
申请公布号 |
US9368356(B2) |
申请公布日期 |
2016.06.14 |
申请号 |
US201414146659 |
申请日期 |
2014.01.02 |
申请人 |
SK hynix Inc. |
发明人 |
Kim Jung-Nam |
分类号 |
H01L21/283;H01L29/417;H01L29/423;H01L29/66;H01L45/00;H01L27/24;H01L21/768;H01L21/285;H01L29/78;H01L29/08 |
主分类号 |
H01L21/283 |
代理机构 |
Perkins Coie LLP |
代理人 |
Perkins Coie LLP |
主权项 |
1. A method for fabricating an electronic device having a semiconductor memory unit, comprising:
forming isolation layers to define active regions in a substrate; forming a plurality of trenches in a substrate; forming gate electrodes, each burying each of the trenches; forming sealing layers, each burying the remaining trench; recessing the sealing layers and the isolation layers to produce protruding portions in the substrate of the active regions; and transforming the protruding portions into silicide layers. |
地址 |
Icheon-Si KR |