摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a device capable of suppressing shape abnormality when processing a substrate or a film formed on the substrate.SOLUTION: The manufacturing method of a device includes: forming a film on a second surface side of a substrate having a first surface and the second surface; cutting the substrate along an area for scheduled cutting; cutting the film along the area for scheduled cutting; injecting particles onto a first cutting part formed by the substrate cutting or a second cutting part formed by the film cutting; and processing the first cutting part or the second cutting part.SELECTED DRAWING: Figure 1 |