发明名称 MANUFACTURING METHOD OF DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a device capable of suppressing shape abnormality when processing a substrate or a film formed on the substrate.SOLUTION: The manufacturing method of a device includes: forming a film on a second surface side of a substrate having a first surface and the second surface; cutting the substrate along an area for scheduled cutting; cutting the film along the area for scheduled cutting; injecting particles onto a first cutting part formed by the substrate cutting or a second cutting part formed by the film cutting; and processing the first cutting part or the second cutting part.SELECTED DRAWING: Figure 1
申请公布号 JP2016139739(A) 申请公布日期 2016.08.04
申请号 JP20150014570 申请日期 2015.01.28
申请人 TOSHIBA CORP 发明人 TAKANO MASAMUNE
分类号 H01L21/301;B24C1/00;H01L21/304 主分类号 H01L21/301
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