| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for reclaiming a semiconductor wafer that is too thin to be reused.SOLUTION: A method of manufacturing a reclaimed semiconductor wafer by cutting out a new semiconductor wafer 12 having a notch 13 from a semiconductor wafer 1 having a notch 11 includes a lamination step for laminating the semiconductor wafer 1, and a cutting step for cutting out a new semiconductor wafer 12 from the laminated semiconductor wafer 1. Since a small semiconductor wafer is usable even if it is thin, even if the semiconductor wafer 1 is thin and cannot be reused, the new semiconductor wafer 12 is usable, and thereby the semiconductor wafer 1 that cannot be reused can be reclaimed to a new semiconductor wafer 12.SELECTED DRAWING: Figure 4 |
