发明名称 Guide plate for probe card
摘要 The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film.
申请公布号 US9459287(B2) 申请公布日期 2016.10.04
申请号 US201414206896 申请日期 2014.03.12
申请人 JAPAN ELECTRONIC MATERIALS CORPORATION;SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 Kimura Teppei;Shiraishi Akinori;Fujihara Kosuke
分类号 G01R1/073 主分类号 G01R1/073
代理机构 Kilyk & Bowersox, P.L.L.C. 代理人 Kilyk & Bowersox, P.L.L.C.
主权项 1. A guide plate for a probe card, the guide plate comprising: a silicon substrate including a surface and a through-hole, the through-hole being configured to guide a probe and including an inner wall face; an edge part of the through-hole, the edge part being constituted by the surface of the silicon substrate and the inner wall face of the through-hole; and a curved-face part formed on the edge part, the curved-face part being formed of a silicon dioxide film, being rounded in an arc shape, and extending from the surface of the silicon substrate to the inner wall face of the through-hole.
地址 JP