发明名称 |
Guide plate for probe card |
摘要 |
The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film. |
申请公布号 |
US9459287(B2) |
申请公布日期 |
2016.10.04 |
申请号 |
US201414206896 |
申请日期 |
2014.03.12 |
申请人 |
JAPAN ELECTRONIC MATERIALS CORPORATION;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
Kimura Teppei;Shiraishi Akinori;Fujihara Kosuke |
分类号 |
G01R1/073 |
主分类号 |
G01R1/073 |
代理机构 |
Kilyk & Bowersox, P.L.L.C. |
代理人 |
Kilyk & Bowersox, P.L.L.C. |
主权项 |
1. A guide plate for a probe card, the guide plate comprising:
a silicon substrate including a surface and a through-hole, the through-hole being configured to guide a probe and including an inner wall face; an edge part of the through-hole, the edge part being constituted by the surface of the silicon substrate and the inner wall face of the through-hole; and a curved-face part formed on the edge part, the curved-face part being formed of a silicon dioxide film, being rounded in an arc shape, and extending from the surface of the silicon substrate to the inner wall face of the through-hole. |
地址 |
JP |