| 摘要 |
A lead frame includes one metal plate 10 having a terminal 15, and the other metal plate 50 joined to the one metal plate 10, on which a mounted component 91 is placed. The one metal plate 10 includes a first connection portion 11 connected to the terminal 15, a first extension portion 12 disposed on one end of the first connection portion 11, and a second extension portion 13 disposed on the other end of the first connection portion 11. The other metal plate 50 includes a pair of first clamping portions 62 configured to clamp the first extension portion 12, and a pair of second clamping portions 63 configured to clamp the second extension portion 13. Each of the pair of first clamping portions 62 is pressed to be extended by a mold, which is used for sealing the mounted component with a resin, so that gaps G between the first extension portion 12 and the clamping portions 62 are filled. Each portion of the pair of second clamping portions 63 is pressed to be extended by the mold, so that gaps G between the second extension portion 13 and the second clamping portions 63 are filled. |
