发明名称 |
Method and apparatus for predicting a growth rate of deposited contaminants |
摘要 |
A lithography system (10) comprising a radiation projection system (20) for projecting radiation onto a substrate, a substrate transport system (30) for loading and positioning the substrate to be processed in the path of the projected radiation, a control system (40) for controlling the substrate transport system to move the substrate, and a resist characterization system (50) arranged for determining whether a specific type of resist is suitable to be exposed by radiation within the lithography system. The resist characterization system (50) may be arranged for exposing the resist on a surface of the substrate with one or more radiation beams, measuring a mass distribution of molecular fragments emitted from the resist, predicting a growth rate of deposited molecular fragments on the basis of a growth rate model and the measured mass distribution, and comparing the expected growth rate with a predetermined threshold growth rate. |
申请公布号 |
US9506881(B2) |
申请公布日期 |
2016.11.29 |
申请号 |
US201214345656 |
申请日期 |
2012.09.19 |
申请人 |
MAPPER LITHOGRAPHY IP B.V. |
发明人 |
Smits Marc |
分类号 |
G01N23/22;G03F7/20;H01J37/304;H01J37/317;B82Y10/00;B82Y40/00;G01N33/00 |
主分类号 |
G01N23/22 |
代理机构 |
Hoyng Monegier LLP |
代理人 |
Hoyng Monegier LLP ;Owen David P. |
主权项 |
1. A lithography system comprising:
a radiation projection system for projecting radiation onto a substrate; a substrate transport system for loading and positioning the substrate to be processed in the path of the projected radiation; a control system for controlling the substrate transport system to move the substrate; and a resist characterization system arranged for determining whether a specific type of resist is suitable to be exposed by radiation within the lithography system;wherein the resist characterization system is arranged for:
exposing the resist on a surface of the substrate with one or more radiation beams; measuring a mass distribution of molecular fragments emitted from the resist; using a growth rate model, based on earlier measurements of radiation induced deposition caused by known molecular fragments for different partial pressures; predicting a growth rate of deposited molecular fragments on the basis of the growth rate model of molecular fragments and the measured mass distribution of molecular fragments, and deriving a partial pressure on the basis of the measured mass distribution of molecular fragments; and comparing the predicted growth rate with a predetermined threshold growth rate, the threshold growth rate being related to a maximum allowable growth rate in the lithography system. |
地址 |
Delft NL |