发明名称 |
METHOD FOR PRODUCING SEMICONDUCTOR LIGHT-EMITTING DEVICE |
摘要 |
A method for producing a semiconductor light-emitting device containing a substrate, an element and an encapsulating material as constituent members is provided. The method involves providing the substrate with the element; potting at least one encapsulating material (i) before curing selected from addition polymerization-type encapsulating materials and polycondensation-type encapsulating materials onto the substrate to cover the element; curing the potted encapsulating material (i); potting a polycondensation-type encapsulating material (ii) before curing onto the encapsulating material (i) after curing which covers the element, and then curing the potted polycondensation-type encapsulating material (ii), thereby laminating the encapsulating material. A semiconductor light-emitting device produced by the method is also provided, in which two or more layers each containing the encapsulating material are laminated. |
申请公布号 |
US2016359092(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
US201515118912 |
申请日期 |
2015.02.06 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
HOTTA Shohei;TAKASHIMA Masayuki |
分类号 |
H01L33/56;H01L33/62 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
1. A method for producing a semiconductor light-emitting device comprising a substrate, an element and an encapsulating material as constituent members, comprising
a first step of providing the substrate with the element; a second step of potting at least one encapsulating material (i) before curing selected from the group consisting of addition polymerization-type encapsulating materials and polycondensation-type encapsulating materials onto the substrate to cover the element; a third step of curing the potted encapsulating material (i) before curing; and a fourth step of potting a polycondensation-type encapsulating material (ii) before curing onto the encapsulating material (i) after curing which covers the element, and then curing the potted polycondensation-type encapsulating material (ii) before curing, thereby laminating the encapsulating material. |
地址 |
Tokyo JP |