发明名称 |
FinFETs with Different Fin Heights |
摘要 |
An integrated circuit structure includes a semiconductor substrate including a first portion in a first device region, and a second portion in a second device region. A first semiconductor fin is over the semiconductor substrate and has a first fin height. A second semiconductor fin is over the semiconductor substrate and has a second fin height. The first fin height is greater than the second fin height. |
申请公布号 |
US2016358926(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
US201615242072 |
申请日期 |
2016.08.19 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lee Tsung-Lin;Yeh Chih Chieh;Chang Chang-Yun;Yuan Feng |
分类号 |
H01L27/11;H01L29/417;H01L29/06;H01L29/78;H01L29/66 |
主分类号 |
H01L27/11 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
forming a first fin extending above a substrate, an isolation region surrounding the first fin, the first fin extending above a top surface of the isolation region by a first depth; forming a gate stack on a top surface and sidewalls of the first fin; recessing the isolation region outside of the gate stack to a second depth using the gate stack as a mask; and epitaxially growing a semiconductor layer on the top surface and sidewalls of the first fin. |
地址 |
Hsin-Chu TW |