发明名称 FinFETs with Different Fin Heights
摘要 An integrated circuit structure includes a semiconductor substrate including a first portion in a first device region, and a second portion in a second device region. A first semiconductor fin is over the semiconductor substrate and has a first fin height. A second semiconductor fin is over the semiconductor substrate and has a second fin height. The first fin height is greater than the second fin height.
申请公布号 US2016358926(A1) 申请公布日期 2016.12.08
申请号 US201615242072 申请日期 2016.08.19
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Lee Tsung-Lin;Yeh Chih Chieh;Chang Chang-Yun;Yuan Feng
分类号 H01L27/11;H01L29/417;H01L29/06;H01L29/78;H01L29/66 主分类号 H01L27/11
代理机构 代理人
主权项 1. A method comprising: forming a first fin extending above a substrate, an isolation region surrounding the first fin, the first fin extending above a top surface of the isolation region by a first depth; forming a gate stack on a top surface and sidewalls of the first fin; recessing the isolation region outside of the gate stack to a second depth using the gate stack as a mask; and epitaxially growing a semiconductor layer on the top surface and sidewalls of the first fin.
地址 Hsin-Chu TW