| 发明名称 |
ARRANGEMENT OF MULTIPLE POWER SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A semiconductor power arrangement includes a chip carrier having a first surface and a second surface opposite the first surface. The semiconductor power arrangement further includes a plurality of power semiconductor chips attached to the chip carrier, wherein the power semiconductor chips are inclined to the first and/or second surface of the chip carrier. |
| 申请公布号 |
US2016358886(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201615171364 |
申请日期 |
2016.06.02 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Meyer-Berg Georg;Fuergut Edward;Mahler Joachim |
| 分类号 |
H01L25/065;H01L25/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor power arrangement, comprising:
a chip carrier having a first surface and a second surface opposite the first surface; and a plurality of power semiconductor chips attached to the chip carrier, wherein the power semiconductor chips are inclined to the first and/or second surface of the chip carrier. |
| 地址 |
Neubiberg DE |
