发明名称 |
GAS SYSTEMS AND METHODS FOR CHAMBER PORTS |
摘要 |
An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects. |
申请公布号 |
US2016358792(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
US201615238604 |
申请日期 |
2016.08.16 |
申请人 |
Applied Materials, Inc. |
发明人 |
Madiwal Nagendra V.;Decottignies Robert Irwin;Nguyen Andrew;Reuter Paul B.;Sico Angela R.;Kuchar Michael;Morey Travis;DiSanto Mitchell |
分类号 |
H01L21/67;C23C16/455 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic device manufacturing system, comprising:
a first chamber configured to receive a substrate therein; a second chamber configured to receive a substrate therein; a chamber port assembly interfacing the first chamber with the second chamber, the chamber port assembly having a substrate transfer area between the first chamber and the second chamber, the substrate transfer area configured to receive a substrate as the substrate is transferred through the chamber port assembly between the first chamber and the second chamber; a gas inlet; a gas conduit member having a gas passageway there through in fluid communication with the gas inlet; and one or more gas nozzles configured to direct a flow of gas received at the gas inlet into the substrate transfer area. |
地址 |
Santa Clara CA US |