发明名称 GAS SYSTEMS AND METHODS FOR CHAMBER PORTS
摘要 An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.
申请公布号 US2016358792(A1) 申请公布日期 2016.12.08
申请号 US201615238604 申请日期 2016.08.16
申请人 Applied Materials, Inc. 发明人 Madiwal Nagendra V.;Decottignies Robert Irwin;Nguyen Andrew;Reuter Paul B.;Sico Angela R.;Kuchar Michael;Morey Travis;DiSanto Mitchell
分类号 H01L21/67;C23C16/455 主分类号 H01L21/67
代理机构 代理人
主权项 1. An electronic device manufacturing system, comprising: a first chamber configured to receive a substrate therein; a second chamber configured to receive a substrate therein; a chamber port assembly interfacing the first chamber with the second chamber, the chamber port assembly having a substrate transfer area between the first chamber and the second chamber, the substrate transfer area configured to receive a substrate as the substrate is transferred through the chamber port assembly between the first chamber and the second chamber; a gas inlet; a gas conduit member having a gas passageway there through in fluid communication with the gas inlet; and one or more gas nozzles configured to direct a flow of gas received at the gas inlet into the substrate transfer area.
地址 Santa Clara CA US