发明名称 |
Bow control in an electronic package |
摘要 |
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a molding compound to attach the substrate to the package substrate.
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申请公布号 |
US7235872(B2) |
申请公布日期 |
2007.06.26 |
申请号 |
US20040931844 |
申请日期 |
2004.08.31 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
KUAN LEE CHOON;CHAI LEE KIAN |
分类号 |
H01L23/48;H01L21/56;H01L23/00;H01L23/498;H05K3/30;H05K3/34 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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